PCBA And Disk Drive Application
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| PCB Laser Marking | Laser surface removal | Laser welding of electronic housing | Wafer cutting | Laser cutting of Ceramics |
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| Laser welding of Plastic | Photochemical processing | Laser marking FR4 | Drilling of Silicon wafers | Marking Electronic |
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| Battery Seam Welding | Seam welding | Polymer Removal | Conductive Heater cutting | Polymer Removal |
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De coating of LCD |
Ablation of Glass | Selective Soldering | FR4 Cutting | Spot Welding |
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| Bonding pad | Laminate | Contact | LED |
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| Clad Roll | Flexible circuit | Flexible substrate for RFID | Molded Contact |
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Pastes for Fuel Cells |
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AOP 22 Anti Oxidation powder |
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Shot Queue time |
Laser cutting System 800 x800 mm |
Automatic De panel X,Y,Z |
Laser marking handler 4 station rotary |
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Laser Engraving with 3D Type3 Programing. |
EASY MARK Handler for Fiber/RSM 10 E AIR |
Laser Cutting Co2 500 |
2000 X 2 WATT 48 KHZ |